Ob-Layer FR4 Printed Circuit Boards
PCB txheej txheem muaj peev xwm
| Tsis muaj. | Qhov project | Technical ntsuas |
| 1 | Txheej | 1-60 (txheej) |
| 2 | Kev ua haujlwm siab tshaj plaws | 545 x 622 mm |
| 3 | Yam tsawg kawg nkaus boardthickness | 4 (txheej) 0.40mm |
| 6 (txheej) 0.60mm | ||
| 8 (txheej) 0.8mm | ||
| 10 (txheej) 1.0mm | ||
| 4 | Yam tsawg kawg kab dav | 0.0762 hli |
| 5 | Qhov sib nrug tsawg kawg nkaus | 0.0762 hli |
| 6 | Yam tsawg kawg nkaus tshuab aperture | 0.15 hli |
| 7 | Qhov phab ntsa tooj liab thickness | 0.015 hli |
| 8 | Metallized aperture kam rau ua | ± 0.05 hli |
| 9 | Non-metallized aperture kam rau ua | ± 0.025 hli |
| 10 | Qhov kam rau ua | ± 0.05 hli |
| 11 | Dimensional kam rau ua | ± 0.076 hli |
| 12 | Yam tsawg kawg nkaus solder choj | 0.08mm ib |
| 13 | Rwb thaiv tsev tsis kam | 1E + 12Ω (ib txwm) |
| 14 | Phaj thickness ratio | 1:10 |
| 15 | Thermal shock | 288 ℃ (4 zaug hauv 10 vib nas this) |
| 16 | Distorted thiab khoov | ≤ 0.7% |
| 17 | Anti-hluav taws xob muaj zog | 1.3KV / hli |
| 18 | Anti-stripping zog | 1.4N / hli |
| 19 | Solder tiv taus hardness | ≥ 6 H |
| 20 | Nplaim retardancy | 94v 0 |
| 21 | Impedance tswj | ± 5% |
Peb ua Printed Circuit Boards nrog 15 xyoo kev paub nrog peb cov kws tshaj lij
4 txheej Flex-Rigid Boards
8 txheej Rigid-Flex PCBs
8 txheej HDI Printed Circuit Boards
Cov khoom siv kuaj thiab tshuaj xyuas
Microscope Test
AOI Inspection
2D Kev Xeem
Kev ntsuas impedance
Kev xeem RoHS
Flying Probe
Kab rov tav Tester
Khoov Teste
Peb Qhov Kev Pabcuam Printed Circuit Boards
. Muab kev txhawb nqa kev muag khoom ua ntej thiab tom qab muag;
. Custom mus txog 40 khaubncaws sab nraud povtseg, 1-2days ceev tig txhim khu kev qha prototyping, Component procurement, SMT Assembly;
. Caters rau ob qho khoom siv kho mob, Kev Tswj Lag Luam, Automotive, Aviation, Consumer Electronics, IOT, UAV, Communications thiab lwm yam.
. Peb pab pawg engineers thiab cov kws tshawb fawb tau mob siab rau ua kom tiav koj cov kev xav tau nrog precision thiab kev tshaj lij.
Ob-txheej FR4 Printed Circuit Boards siv rau hauv cov ntsiav tshuaj
1. Fais fab kev faib tawm: Lub hwj chim faib ntawm cov ntsiav tshuaj PC txais ob txheej txheej FR4 PCB. Cov PCBs no ua kom muaj txiaj ntsig zoo ntawm cov kab hluav taws xob kom ntseeg tau tias muaj qhov hluav taws xob zoo thiab kev faib tawm mus rau ntau yam khoom ntawm cov ntsiav tshuaj, suav nrog cov zaub, processor, nco thiab txuas modules.
2. Teeb liab routing: Ob txheej txheej FR4 PCB muab qhov tsim nyog txuas thiab routing rau cov teeb liab kis tau tus mob ntawm cov khoom sib txawv thiab cov qauv hauv cov ntsiav tshuaj computer. Lawv txuas ntau yam sib xyaw ua ke (ICs), cov khoom sib txuas, cov khoom siv hluav taws xob, thiab lwm yam khoom siv, ua kom muaj kev sib txuas lus zoo thiab cov ntaub ntawv hloov mus rau hauv cov khoom siv.
3. Component Mounting: Ob txheej txheej FR4 PCB yog tsim los ua kom haum rau kev sib txuas ntawm ntau yam Surface Mount Technology (SMT) cov khoom hauv cov ntsiav tshuaj. Cov no suav nrog microprocessors, nco modules, capacitors, resistors, integrated circuits thiab connectors. PCB layout thiab tsim kom muaj qhov sib nrug thiab kev teeb tsa ntawm cov khoom kom ua kom zoo dua qub thiab txo cov teeb liab cuam tshuam.
4. Loj thiab compactness: FR4 PCBs paub txog lawv cov durability thiab kuj nyias profile, ua rau lawv haum rau siv nyob rau hauv compact pab kiag li lawm xws li ntsiav tshuaj. Ob-txheej FR4 PCBs tso cai rau cov khoom siv loj hauv qhov chaw txwv, ua rau cov tuam txhab tsim cov ntsiav tshuaj nyias thiab sib dua yam tsis muaj kev cuam tshuam rau kev ua haujlwm.
5. Nqi-zoo: Piv nrog ntau tshaj PCB substrates, FR4 yog ib yam khoom uas pheej yig. Ob txheej txheej FR4 PCBs muab cov kev daws teeb meem zoo rau cov neeg tsim khoom lag luam uas xav tau kom cov nqi tsim khoom qis thaum tswj xyuas qhov zoo thiab kev ntseeg siab.
Ob txheej txheej FR4 Printed Circuit Boards li cas txhim khu kev ua haujlwm thiab kev ua haujlwm ntawm cov ntsiav tshuaj?
1. Cov dav hlau hauv av thiab lub zog: Ob txheej FR4 PCBs feem ntau muaj cov dav hlau hauv av thiab lub zog los pab txo cov suab nrov thiab ua kom zoo dua qhov kev faib hluav taws xob. Cov dav hlau no ua raws li kev siv ruaj khov rau cov teeb liab kev ncaj ncees thiab txo qis kev cuam tshuam ntawm cov sib txawv circuits thiab cov khoom.
2. Tswj impedance routing: Txhawm rau kom ntseeg tau tias cov teeb liab sib kis tau zoo thiab txo cov teeb liab attenuation, tswj impedance routing yog siv rau hauv kev tsim ntawm ob txheej FR4 PCB. Cov kab no tau ua tib zoo tsim nrog qhov dav dav thiab qhov sib txawv kom ua tau raws li qhov xav tau ntawm impedance ntawm cov teeb liab ceev thiab cuam tshuam xws li USB, HDMI lossis WiFi.
3. EMI / EMC shielding: Ob txheej txheej FR4 PCB tuaj yeem siv cov cuab yeej tiv thaiv kom tsis txhob cuam tshuam hluav taws xob (EMI) thiab xyuas kom muaj hluav taws xob sib raug zoo (EMC). Cov khaubncaws sab nraud povtseg lossis cov ntaub thaiv npog tuaj yeem muab ntxiv rau PCB tsim kom cais cov hluav taws xob rhiab los ntawm cov chaw EMI sab nraud thiab tiv thaiv cov pa tawm uas tuaj yeem cuam tshuam nrog lwm cov khoom siv lossis cov tshuab.
4. High-frequency tsim kev txiav txim siab: Rau cov ntsiav tshuaj uas muaj cov khoom siv ntau zaus lossis cov qauv xws li kev sib txuas ntawm tes (LTE/5G), GPS lossis Bluetooth, qhov tsim ntawm ob txheej FR4 PCB yuav tsum xav txog kev ua haujlwm siab. Qhov no suav nrog impedance txuam, tswj crosstalk thiab RF routing cov tswv yim kom paub tseeb tias qhov teeb meem zoo tshaj plaws thiab tsis tshua muaj kev sib kis.
