Ntau hom kev tsim khoom siv thev naus laus zis ntawm HDI thev naus laus zis PCB

Taw qhia:

High-density interconnect (HDI) thev naus laus zis PCBs tau hloov pauv kev lag luam hluav taws xob los ntawm kev ua haujlwm ntau dua hauv cov khoom siv me me, sib dua. Cov PCBs siab heev no yog tsim los txhim kho cov teeb liab zoo, txo cov suab nrov cuam tshuam thiab txhawb nqa miniaturization. Hauv no blog ncej, peb yuav tshawb txog ntau yam kev tsim khoom siv los tsim PCBs rau HDI thev naus laus zis. Los ntawm kev nkag siab txog cov txheej txheem nyuaj no, koj yuav tau txais kev nkag siab rau hauv lub ntiaj teb nyuaj ntawm kev tsim hluav taws xob Circuit Court board thiab yuav ua li cas nws pab txhawb rau kev nce qib ntawm cov cuab yeej niaj hnub no.

1. Laser Direct Imaging (LDI):

Laser Direct Imaging (LDI) yog cov cuab yeej nrov siv los tsim PCBs nrog HDI thev naus laus zis. Nws hloov cov txheej txheem photolithography ib txwm muaj thiab muab cov peev xwm ua tau zoo dua. LDI siv lub laser ncaj qha nthuav tawm photoresist yam tsis tas yuav tsum muaj lub npog ntsej muag lossis stencil. Qhov no ua rau cov tuam txhab lag luam kom ua tiav qhov me me qhov loj me, siab dua circuit density, thiab siab dua rau npe.

Tsis tas li ntawd, LDI tso cai rau kev tsim cov kab hluav taws xob zoo, txo qhov chaw ntawm lem thiab txhim kho tag nrho cov teeb liab kev ncaj ncees. Nws kuj tseem ua rau muaj qhov tseeb microvias, uas yog qhov tseem ceeb rau HDI thev naus laus zis PCBs. Microvias yog siv los txuas cov txheej txheem sib txawv ntawm PCB, yog li ua kom txoj kev ceev thiab txhim kho kev ua haujlwm.

2. Sequential Building (SBU):

Sequential Assembly (SBU) yog lwm qhov tseem ceeb ntawm kev tsim khoom siv dav siv hauv PCB ntau lawm rau HDI thev naus laus zis. SBU koom nrog txheej txheej txheej txheej ntawm PCB, tso cai rau cov txheej txheem ntau dua thiab qhov me me. Lub tshuab siv ntau txheej txheej nyias nyias, txhua tus nrog nws tus kheej sib txuas thiab vias.

SBUs pab ua ke cov kev sib txuas ua ke rau hauv cov qauv me me, ua rau lawv zoo tagnrho rau cov khoom siv hluav taws xob sib txuas. Cov txheej txheem yuav siv cov txheej insulating dielectric thiab tom qab ntawd tsim qhov yuav tsum tau circuitry los ntawm cov txheej txheem xws li additive plating, etching thiab drilling. Vias yog tom qab ntawd tsim los ntawm laser drilling, mechanical drilling lossis siv cov txheej txheem plasma.

Thaum lub sijhawm SBU txheej txheem, pab pawg tsim khoom yuav tsum tswj hwm kev tswj hwm nruj kom ntseeg tau tias kev sib raug zoo thiab kev sau npe ntawm ntau txheej txheej. Laser drilling feem ntau yog siv los tsim cov kab me me microvias, yog li ua kom tag nrho kev ntseeg siab thiab kev ua tau zoo ntawm HDI thev naus laus zis PCBs.

3. Hybrid manufacturing technology:

Raws li kev siv tshuab txuas ntxiv mus, hybrid manufacturing technology tau dhau los ua cov kev daws teeb meem zoo tshaj plaws rau HDI thev naus laus zis PCBs. Cov thev naus laus zis no muab cov txheej txheem ib txwm muaj thiab cov txheej txheem siab heev los txhim kho qhov yooj yim, txhim kho kev tsim khoom thiab txhim kho kev siv cov peev txheej.

Ib txoj hauv kev sib xyaw ua ke yog los ua ke LDI thiab SBU thev naus laus zis los tsim cov txheej txheem tsim khoom zoo heev. LDI yog siv rau cov qauv zoo meej thiab zoo-pitch circuits, thaum SBU muab cov txheej txheem tsim nyog los ntawm txheej txheej thiab kev koom ua ke ntawm cov circuits nyuaj. Qhov kev sib xyaw ua ke no ua kom muaj kev vam meej ntawm cov khoom siv high-density, high-performance PCBs.

Tsis tas li ntawd, kev koom ua ke ntawm 3D luam ntawv thev naus laus zis nrog cov txheej txheem tsim PCB ib txwm ua kom yooj yim rau kev tsim cov duab thiab kab noj hniav hauv HDI thev naus laus zis PCBs. Qhov no tso cai rau kev tswj xyuas thermal zoo, txo qhov hnyav thiab txhim kho kev ruaj ntseg.

Xaus:

Cov cuab yeej tsim khoom siv hauv HDI Technology PCBs ua lub luag haujlwm tseem ceeb hauv kev tsav tsheb tshiab thiab tsim cov khoom siv hluav taws xob siab heev. Laser direct imaging, sequential build thiab hybrid manufacturing technologies muaj qhov zoo tshwj xeeb uas thawb cov ciam teb ntawm miniaturization, teeb liab kev ncaj ncees thiab Circuit Court ceev. Nrog rau kev nce qib ntawm kev siv thev naus laus zis, kev tsim cov thev naus laus zis tshiab yuav txhim kho lub peev xwm ntawm HDI thev naus laus zis PCB thiab txhawb kev nce qib ntawm kev lag luam hluav taws xob.