FPC Flex PCB Manufacturing: Nto Kho Txheej Txheem Taw Qhia

Kab lus no yuav muab cov lus qhia dav dav ntawm cov txheej txheem kho saum npoo rau FPC Flex PCB kev tsim khoom.Los ntawm qhov tseem ceeb ntawm kev npaj nto mus rau cov txheej txheem txheej txheej sib txawv, peb yuav npog cov ntaub ntawv tseem ceeb los pab koj nkag siab thiab siv cov txheej txheem kev npaj saum npoo kom zoo.

Taw qhia:

Flexible PCBs (Flexible Printed Circuit Boards) tau txais txiaj ntsig thoob plaws ntau qhov kev lag luam rau lawv cov kev ua tau zoo thiab muaj peev xwm hloov mus rau cov duab nyuaj.Cov txheej txheem npaj nto ua lub luag haujlwm tseem ceeb hauv kev ua kom muaj kev ua tau zoo tshaj plaws thiab kev ntseeg tau ntawm cov kev hloov pauv hloov pauv no.Kab lus no yuav muab cov lus qhia dav dav ntawm cov txheej txheem kho saum npoo rau FPC Flex PCB kev tsim khoom.Los ntawm qhov tseem ceeb ntawm kev npaj nto mus rau cov txheej txheem txheej txheej sib txawv, peb yuav npog cov ntaub ntawv tseem ceeb los pab koj nkag siab thiab siv cov txheej txheem kev npaj saum npoo kom zoo.

Cov ntsiab lus:

1. Qhov tseem ceeb ntawm kev kho deg hauv FPC flex PCB manufacturing:

Kev kho deg yog qhov tseem ceeb hauv FPC Flexible boards manufacturing vim nws ua haujlwm rau ntau lub hom phiaj.Nws yooj yim rau soldering, ua kom zoo adhesion, thiab tiv thaiv cov kab hluav taws xob los ntawm oxidation thiab ib puag ncig degradation.Qhov kev xaiv thiab qhov zoo ntawm kev kho deg ncaj qha cuam tshuam rau kev ntseeg tau thiab kev ua haujlwm tag nrho ntawm PCB.

Nto tiav hauv FPC Flex PCB manufacturing pab ntau lub hom phiaj tseem ceeb.Ua ntej, nws yooj yim rau soldering, kom ntseeg tau tias kev sib raug zoo ntawm cov khoom siv hluav taws xob rau PCB.Kev kho saum npoo txhim khu kev sib txuas kom muaj zog thiab txhim khu kev qha kev sib txuas ntawm cov khoom siv thiab PCB.Yog tsis muaj kev npaj saum npoo kom zoo, cov pob qij txha tuaj yeem ua tsis muaj zog thiab ua rau tsis ua haujlwm, ua rau tsis muaj txiaj ntsig thiab muaj peev xwm puas tsuaj rau tag nrho lub voj voog.
Lwm qhov tseem ceeb ntawm kev npaj nto hauv FPC Flex PCB kev tsim khoom yog ua kom zoo adhesion.FPC flex PCBs feem ntau muaj kev khoov hnyav thiab flexing thaum lawv lub neej ua haujlwm, uas ua rau muaj kev ntxhov siab rau PCB thiab nws cov khoom.Kev kho saum npoo muab ib txheej ntawm kev tiv thaiv kom ntseeg tau tias cov khoom tiv thaiv ruaj khov rau PCB, tiv thaiv kev cuam tshuam lossis kev puas tsuaj thaum tuav.Qhov no tseem ceeb tshwj xeeb tshaj yog nyob rau hauv cov ntawv thov uas muaj kev ntxhov siab lossis kev vibration.
Tsis tas li ntawd, kev kho saum npoo tiv thaiv cov kab hluav taws xob ntawm FPC Flex PCB los ntawm oxidation thiab ib puag ncig degradation.Cov PCBs no tas li raug rau ntau yam ib puag ncig xws li av noo, kub hloov pauv thiab tshuaj lom neeg.Yog tias tsis muaj qhov kev npaj zoo txaus, cov kab hluav taws xob muaj peev xwm tuaj yeem ua rau lub sijhawm, ua rau hluav taws xob tsis ua haujlwm thiab kev ua haujlwm tsis zoo.Kev kho saum npoo ua raws li kev thaiv, tiv thaiv PCB los ntawm ib puag ncig thiab ua rau nws lub neej ntev thiab kev ntseeg siab.

2.Cov txheej txheem kev kho saum npoo rau FPC flex PCB raug:

Nqe lus no yuav tham txog qhov nthuav dav txog cov txheej txheem kev kho saum npoo uas siv ntau tshaj plaws hauv FPC Flexible boards manufacturing, suav nrog Kub Cua Kub Solder Leveling (HASL), Electroless Nickel Immersion Gold (ENIG), Organic Solderability Preservative (OSP), Immersion Tin (ISn) thiab electroplating (E-plating).Txhua txoj kev yuav piav qhia nrog rau nws qhov zoo thiab qhov tsis zoo.

Cua kub Solder Leveling (HASL):
HASL yog ib txoj kev kho saum npoo uas siv dav heev vim nws qhov ua tau zoo thiab tus nqi-zoo.Cov txheej txheem cuam tshuam nrog txheej txheej tooj liab nrog ib txheej ntawm solder, uas yog ces rhuab nrog cua kub los tsim ib tug du, tiaj tus.HASL muaj qhov zoo tshaj plaws solderability thiab yog sib xws nrog ntau yam ntawm cov khoom thiab cov txheej txheem soldering.Txawm li cas los xij, nws kuj muaj kev txwv xws li qhov tsis sib xws ntawm qhov chaw tiav thiab ua rau muaj kev puas tsuaj rau cov cim me me thaum ua.
Electroless Nickel Immersion Kub (ENIG):
ENIG yog qhov kev xaiv nrov hauv kev tsim hluav taws xob flex vim nws qhov kev ua tau zoo thiab kev ntseeg tau.Cov txheej txheem cuam tshuam nrog kev tso cov txheej nyias ntawm cov npib tsib xee rau ntawm qhov chaw tooj liab los ntawm cov tshuaj tiv thaiv tshuaj, uas tom qab ntawd muab tso rau hauv cov tshuaj electrolyte uas muaj cov khoom kub.ENIG muaj zoo heev corrosion kuj, uniform thickness faib thiab zoo solderability.Txawm li cas los xij, cov txheej txheem siab ntsig txog cov nqi thiab cov teeb meem uas muaj peev xwm dub ncoo yog qee qhov tsis zoo los xav txog.
Organic Solderability Preservative (OSP):
OSP yog ib txoj kev kho saum npoo uas cuam tshuam nrog txheej txheej tooj liab nrog cov organic nyias zaj duab xis los tiv thaiv nws los ntawm oxidizing.Cov txheej txheem no yog ib puag ncig tus phooj ywg vim nws tshem tawm qhov xav tau ntawm cov hlau hnyav.OSP muab qhov chaw tiaj tus thiab zoo solderability, ua rau nws haum rau cov khoom siv suab zoo.Txawm li cas los xij, OSP muaj lub neej txee tsawg, muaj kev cuam tshuam rau kev tuav, thiab yuav tsum muaj kev cia khoom kom zoo los tswj nws cov txiaj ntsig.
Immersion Tin (ISn):
ISn yog ib txoj hauv kev kho saum npoo uas cuam tshuam nrog kev hloov pauv hloov pauv hauv lub dab da dej ntawm molten tin.Cov txheej txheem no tsim ib txheej nyias ntawm tin rau ntawm qhov chaw tooj liab, uas muaj qhov zoo heev solderability, flatness thiab corrosion kuj.ISn muab lub ntsej muag du ua rau nws zoo tagnrho rau kev siv suab zoo.Txawm li cas los xij, nws muaj qhov txwv tsis pub muaj cua sov thiab yuav tsum tau tuav tshwj xeeb vim tin lub brittleness.
Electroplating (E plating):
Electroplating yog ib txoj kev kho saum npoo ntawm cov khoom siv hluav taws xob hloov tau yooj yim.Cov txheej txheem yuav tso ib txheej hlau rau ntawm qhov chaw tooj liab los ntawm cov tshuaj tiv thaiv electrochemical.Nyob ntawm daim ntawv thov yuav tsum tau, electroplating muaj nyob rau hauv ntau yam kev xaiv xws li kub, nyiaj, npib tsib xee los yog tin plating.Nws muaj zoo heev durability, solderability thiab corrosion kuj.Txawm li cas los xij, nws tseem kim dua piv rau lwm txoj kev kho saum npoo thiab yuav tsum muaj cov cuab yeej siv thiab kev tswj hwm.

3.Kev ceev faj rau xaiv txoj kev kho saum npoo kom raug hauv FPC flex PCB raug:

Kev xaiv qhov zoo saum npoo tiav rau FPC hloov pauv hloov pauv yuav tsum tau ua tib zoo xav txog ntau yam xws li daim ntawv thov, ib puag ncig, kev xav tau ntawm cov khoom siv, thiab cov nqi siv tau zoo.Tshooj lus no yuav muab cov lus qhia txog kev xaiv ib txoj hauv kev tsim nyog raws li cov kev xav no.

Paub cov neeg siv khoom xav tau:
Ua ntej delving rau hauv ntau yam kev kho deg muaj, nws yog ib qho tseem ceeb kom muaj kev nkag siab meej ntawm cov neeg siv khoom xav tau.Xav txog cov hauv qab no:

Daim ntawv thov:
Txiav txim siab daim ntawv thov ntawm koj FPC hloov tau PCB.Puas yog rau cov neeg siv khoom siv hluav taws xob, tsheb, kev kho mob lossis cov khoom siv?Txhua qhov kev lag luam tej zaum yuav muaj cov kev cai tshwj xeeb, xws li tsis kam mus rau qhov kub thiab txias, tshuaj lom neeg lossis kev ntxhov siab.
Ib puag ncig tej yam kev mob:
Ntsuas cov xwm txheej ib puag ncig uas PCB yuav ntsib.Nws puas yuav raug rau cov dej noo, av noo, huab cua kub lossis cov khoom corrosive?Cov yam tseem ceeb no yuav cuam tshuam rau txoj kev npaj saum npoo los muab kev tiv thaiv zoo tshaj plaws tiv thaiv oxidation, corrosion thiab lwm yam degradation.
Solderability xav tau:
Tshawb xyuas cov kev xav tau ntawm FPC hloov tau PCB.Lub Rooj Tswjhwm Saib puas yuav dhau los ntawm yoj soldering lossis reflow soldering txheej txheem?Kev kho deg sib txawv muaj qhov sib txawv nrog cov txheej txheem vuam.Ua li no rau hauv tus account yuav ua kom ntseeg tau tias cov pob qij txha txhim khu kev qha thiab tiv thaiv cov teeb meem xws li solderability tsis xws luag thiab qhib.

Tshawb cov txheej txheem kho saum npoo:
Nrog kev nkag siab meej ntawm cov neeg siv khoom xav tau, nws yog lub sijhawm los tshawb txog cov kev kho mob saum npoo av:

Organic Solderability Preservative (OSP):
OSP yog tus neeg sawv cev kho mob nrov rau FPC hloov pauv PCB vim nws cov txiaj ntsig zoo thiab kev tiv thaiv ib puag ncig.Nws muab cov txheej tiv thaiv nyias uas tiv thaiv oxidation thiab yooj yim rau soldering.Txawm li cas los xij, OSP tej zaum yuav muaj kev tiv thaiv tsawg los ntawm ib puag ncig hnyav thiab lub neej txee luv dua li lwm txoj hauv kev.
Electroless Nickel Immersion Kub (ENIG):
ENIG yog dav siv nyob rau hauv ntau yam lag luam vim nws zoo heev solderability, corrosion kuj thiab flatness.Cov txheej kub ua kom muaj kev sib raug zoo, thaum lub nickel txheej muab oxidation zoo heev thiab kev tiv thaiv ib puag ncig hnyav.Txawm li cas los xij, ENIG kuj tseem kim piv rau lwm txoj hauv kev.
Electroplated Hard Kub (Hard Kub):
Cov kub kub yog qhov ruaj khov heev thiab muab kev tiv thaiv zoo heev, ua rau nws tsim nyog rau cov ntawv thov uas muaj qhov rov ua dua thiab qhov hnyav hnyav.Txawm li cas los xij, nws yog qhov kev xaiv kim tshaj plaws thiab tej zaum yuav tsis xav tau rau txhua daim ntawv thov.
Electroless Nickel Electroless Palladium Immersion Kub (ENEPIG):
ENEPIG yog ib tug multifunctional deg kho tus neeg sawv cev haum rau ntau yam kev siv.Nws muab cov txiaj ntsig zoo ntawm npib tsib xee thiab kub txheej nrog cov txiaj ntsig ntxiv ntawm cov txheej nruab nrab palladium, muab cov xaim zoo heev thiab kev tiv thaiv corrosion.Txawm li cas los xij, ENEPIG nyiam kim dua thiab nyuaj rau kev ua haujlwm.

4.Comprehensive Step-by-Step Guide to Surface Preparation Processes in FPC flex PCB manufacturing:

Txhawm rau kom ua tiav qhov kev ua tiav ntawm cov txheej txheem npaj saum npoo av, nws yog ib qho tseem ceeb kom ua raws li txoj hauv kev.Tshooj lus no yuav muab cov lus qhia ntxaws ntxaws qhia txog kev kho mob ua ntej, tshuaj tua kab mob, daim ntawv thov flux, txheej txheej saum npoo thiab txheej txheem tom qab kho.Txhua kauj ruam tau piav qhia meej, qhia txog cov txheej txheem cuam tshuam thiab kev coj ua zoo tshaj plaws.

Kauj ruam 1: Preprocessing
Pretreatment yog thawj kauj ruam hauv kev npaj nto thiab suav nrog kev ntxuav thiab tshem tawm cov kab mob ntawm qhov chaw.
Ua ntej tshuaj xyuas qhov chaw rau kev puas tsuaj, imperfections lossis corrosion.Cov teeb meem no yuav tsum tau daws ua ntej yuav ua li cas ntxiv.Tom qab ntawd, siv cov cua compressed, txhuam, los yog lub tshuab nqus tsev kom tshem tawm cov khoom xoob, plua plav, lossis av.Txhawm rau kom tsis txhob muaj kab mob ntau dhau, siv cov kuab tshuaj los yog tshuaj ntxuav tes uas tsim tshwj xeeb rau cov khoom siv saum npoo av.Xyuas kom lub ntsej muag qhuav kom huv si tom qab ntxuav, vim tias cov dej seem seem tuaj yeem cuam tshuam cov txheej txheem tom ntej.
Kauj Ruam 2: Tshuaj ntxuav
Kev tu tshuaj muaj xws li tshem tawm cov kab mob seem ntawm qhov chaw.
Xaiv cov tshuaj ntxuav kom tsim nyog raws li cov khoom siv saum npoo av thiab hom kev sib kis.Siv tshuaj ntxuav kom sib npaug rau saum npoo thiab tso cai rau lub sijhawm sib cuag txaus rau kev tshem tawm zoo.Siv txhuam txhuam los yog txhuam txhuam kom maj mam txhuam qhov chaw, ua tib zoo saib xyuas thaj chaw nyuaj.Yaug qhov chaw kom huv si nrog dej kom tshem tawm cov khoom seem ntawm cov tshuaj ntxuav.Cov txheej txheem tshuaj ntxuav tu kom huv si kom huv si thiab npaj rau kev ua haujlwm tom ntej.
Kauj ruam 3: Flux Application
Daim ntawv thov ntawm flux yog ib qho tseem ceeb rau cov txheej txheem brazing los yog soldering vim nws txhawb nqa zoo adhesion thiab txo oxidation.
Xaiv hom flux tsim nyog raws li cov ntaub ntawv yuav tsum tau txuas thiab cov txheej txheem tshwj xeeb yuav tsum tau ua.Siv cov flux sib npaug rau thaj tsam sib koom ua ke, ua kom muaj kev tiv thaiv tiav.Ceev faj tsis txhob siv cov dej ntau dhau vim nws yuav ua rau muaj teeb meem soldering.Flux yuav tsum tau siv tam sim ntawd ua ntej cov txheej txheem soldering los yog soldering kom nws cov hauj lwm zoo.
Kauj Ruam 4: Txheej Txheej
Cov txheej txheej saum npoo pab tiv thaiv qhov chaw ntawm ib puag ncig, tiv thaiv corrosion thiab txhim kho lawv cov tsos.
Ua ntej siv cov txheej txheem, npaj raws li cov neeg tsim khoom cov lus qhia.Siv lub tsho tiv no kom zoo siv txhuam, cov menyuam los yog cov tshuaj tsuag, kom ntseeg tau tias muaj kev tiv thaiv zoo thiab du.Nco ntsoov lub sijhawm kom qhuav los yog kho lub sijhawm ntawm cov tsho loj.Txhawm rau kom tau txais txiaj ntsig zoo tshaj plaws, tswj hwm ib puag ncig zoo xws li kub thiab av noo theem thaum kho.
Kauj Ruam 5: Cov txheej txheem tom qab ua tiav
Cov txheej txheem tom qab kev kho mob yog ib qho tseem ceeb los xyuas kom meej lub neej ntev ntawm cov txheej txheej saum npoo thiab tag nrho cov txheej txheem zoo ntawm qhov chaw npaj.
Tom qab txheej txheej tau kho tag nrho, tshuaj xyuas qhov tsis zoo, npuas lossis tsis sib xws.Kho cov teeb meem no los ntawm kev xuab zeb lossis polishing saum npoo, yog tias tsim nyog.Kev saib xyuas tsis tu ncua thiab kev tshuaj xyuas yog qhov tseem ceeb los txheeb xyuas cov cim ntawm kev hnav lossis kev puas tsuaj hauv cov txheej txheem kom nws tuaj yeem kho tam sim lossis rov siv dua yog tias xav tau.

5.Kev Tswjhwm Zoo thiab Kev Ntsuas hauv FPC flex PCB tsim cov txheej txheem kho deg:

Kev tswj xyuas kom zoo thiab kev kuaj xyuas yog qhov tseem ceeb los xyuas qhov ua tau zoo ntawm cov txheej txheem npaj nto.Tshooj lus no yuav tham txog ntau yam kev sim, suav nrog kev tshuaj xyuas qhov muag, kev kuaj adhesion, kuaj kev sib tw, thiab kev ntsuam xyuas kev ntseeg tau, kom ntseeg tau tias muaj txiaj ntsig zoo thiab kev ntseeg siab ntawm cov khoom siv FPC Flex PCBs.

Kev kuaj pom pom:
Kev soj ntsuam pom yog ib qho yooj yim tab sis tseem ceeb hauv kev tswj kom zoo.Nws cuam tshuam rau qhov pom ntawm qhov chaw ntawm PCB rau txhua qhov tsis xws luag xws li khawb, oxidation lossis paug.Qhov kev tshuaj ntsuam no tuaj yeem siv cov cuab yeej kho qhov muag lossis txawm tias lub tshuab tsom iav los kuaj xyuas qhov tsis xws luag uas yuav cuam tshuam rau PCB kev ua haujlwm lossis kev ntseeg siab.
Kev Ntsuas Adhesion:
Kev soj ntsuam adhesion yog siv los ntsuas lub zog ntawm adhesion ntawm kev kho saum npoo los yog txheej thiab cov hauv qab substrate.Qhov kev ntsuam xyuas no ua kom paub tseeb tias qhov ua tiav yog ruaj khov rau PCB, tiv thaiv kev ua kom ntxov ntxov los yog tev tawm.Raws li cov kev cai tshwj xeeb thiab cov qauv, cov kev sib txawv adhesion tuaj yeem siv tau, xws li kev kuaj kab xev, kuaj kos lossis rub tawm.
Kev Xeem Solderability:
Solderability kuaj xyuas qhov muaj peev xwm ntawm kev kho saum npoo kom yooj yim rau cov txheej txheem soldering.Qhov kev ntsuam xyuas no ua kom paub tseeb tias cov txheej txheem PCB muaj peev xwm tsim cov khoom siv hluav taws xob muaj zog thiab txhim khu kev qha nrog cov khoom siv hluav taws xob.Cov txheej txheem kev ntsuas kev sib tw feem ntau suav nrog kev sim ntsuas ntab ntab, ntsuas qhov ntsuas qhov sib npaug, lossis ntsuas lub pob ntsuas ntsuas.
Kev Ntsuam Xyuas Kev Ntseeg:
Kev ntsuam xyuas kev ntseeg tau ntsuas qhov kev ua tau zoo mus ntev thiab ua haujlwm ntev ntawm FPC Flex PCBs nyob rau hauv ntau yam mob.Qhov kev sim no tso cai rau cov tuam txhab los ntsuas PCB qhov tsis kam mus rau qhov kub thiab txias, av noo, corrosion, mechanical stress, thiab lwm yam ib puag ncig.Kev ntsuas lub neej nrawm thiab kev sim ua ib puag ncig, xws li kev caij tsheb kauj vab, kev sim tshuaj ntsev los yog kev vibration, feem ntau yog siv rau kev ntsuam xyuas kev ntseeg tau.
Los ntawm kev siv cov txheej txheem kev tswj hwm thiab kev soj ntsuam zoo, cov tuam txhab tuaj yeem ua kom ntseeg tau tias FPC Flex PCBs ua raws li cov qauv thiab cov kev qhia tshwj xeeb.Cov kev ntsuas no pab txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau txhawm rau thaum ntxov hauv cov txheej txheem tsim khoom thiab txhim kho cov khoom ua haujlwm tag nrho thiab kev ntseeg tau.

6.Kev daws teeb meem kev npaj ntog hauv FPC flex PCB manufacturing:

Cov teeb meem kho deg tuaj yeem tshwm sim thaum lub sijhawm tsim khoom, cuam tshuam rau tag nrho qhov zoo thiab kev ua haujlwm ntawm FPC hloov pauv PCB.Tshooj lus no yuav txheeb xyuas cov teeb meem kev npaj saum npoo av thiab muab cov lus qhia daws teeb meem kom kov yeej cov teeb meem no tau zoo.

Adhesion tsis zoo:
Yog tias qhov ua tiav tsis ua raws li PCB substrate, nws yuav ua rau delamination lossis tev.Qhov no tuaj yeem yog vim muaj cov kab mob sib kis, tsis txaus ntawm qhov roughness, lossis ua kom tsis txaus ntawm qhov chaw.Txhawm rau tiv thaiv qhov no, xyuas kom lub PCB nto yog huv si kom tshem tawm cov kab mob los yog cov seem seem ua ntej tuav.Tsis tas li ntawd, ua kom zoo dua qhov roughness thiab xyuas kom meej cov txheej txheem ua kom zoo, xws li kev kho ntshav plasma lossis tshuaj ua kom muaj zog, yog siv los txhim kho adhesion.
Tsis sib xws txheej lossis plating thickness:
Cov txheej tsis sib xws lossis plating thickness tuaj yeem yog qhov tshwm sim ntawm kev tswj tsis txaus lossis kev hloov pauv hauv qhov roughness.Qhov teeb meem no cuam tshuam rau kev ua haujlwm thiab kev ntseeg siab ntawm PCB.Txhawm rau kov yeej qhov teeb meem no, tsim thiab saib xyuas cov txheej txheem tsim nyog xws li txheej txheej lossis plating lub sijhawm, qhov kub thiab txias thiab kev daws teeb meem.Xyaum ua kom muaj kev ntxhov siab lossis kev ntxhov siab thaum lub sij hawm txheej los yog plating kom ntseeg tau tias muaj kev sib faib.
Oxidation:
PCBs uas tau kho saum npoo tuaj yeem oxidize vim raug ya raws, huab cua, lossis lwm yam oxidizing tus neeg sawv cev.Oxidation tuaj yeem ua rau tsis zoo solderability thiab txo qhov kev ua haujlwm tag nrho ntawm PCB.Txhawm rau txo qis oxidation, siv cov kev kho mob tsim nyog xws li cov organic coatings lossis cov yeeb yaj kiab tiv thaiv kom muaj kev tiv thaiv kev ya raws thiab oxidizing cov neeg ua haujlwm.Siv cov txheej txheem tuav thiab khaws cia kom zoo kom txo tau cov huab cua thiab noo noo tsawg.
Kev kis kab mob:
Kev sib kis ntawm PCB nto tuaj yeem cuam tshuam tsis zoo rau qhov adhesion thiab solderability ntawm qhov chaw tiav.Cov kab mob sib kis muaj xws li plua plav, roj, cov ntiv tes, lossis cov khoom seem ntawm cov txheej txheem dhau los.Txhawm rau tiv thaiv qhov no, tsim kom muaj kev tu kom zoo kom tshem tawm cov kab mob ua ntej kev npaj nto.Siv cov txheej txheem pov tseg kom tsim nyog kom txo qis kev sib chwv tes lossis lwm qhov chaw ntawm kev sib kis.
Poor Solderability:
Tsis zoo solderability tuaj yeem tshwm sim los ntawm qhov tsis muaj qhov ua kom lub ntsej muag lossis kev sib kis ntawm PCB nto.Tsis zoo solderability tuaj yeem ua rau weld tsis xws luag thiab cov pob qij txha tsis muaj zog.Txhawm rau txhim kho solderability, xyuas kom meej cov txheej txheem ua kom lub ntsej muag zoo xws li kev kho ntshav plasma lossis tshuaj lom neeg ua kom siv los txhim kho cov ntub dej ntawm PCB nto.Tsis tas li ntawd, siv qhov kev pab cuam tu kom zoo kom tshem tawm cov kab mob uas tuaj yeem cuam tshuam cov txheej txheem vuam.

7. Kev txhim kho yav tom ntej ntawm FPC flex board manufacturing nto kho:

Kev ua haujlwm ntawm qhov chaw ua tiav rau FPC hloov pauv PCBs txuas ntxiv hloov kho kom tau raws li cov kev xav tau ntawm cov thev naus laus zis tshiab thiab kev siv.Tshooj lus no yuav tham txog kev txhim kho yav tom ntej hauv cov txheej txheem kho saum npoo xws li cov ntaub ntawv tshiab, txheej txheej txheej txheej txheej txheem, thiab cov kev daws teeb meem zoo ib puag ncig.

Lub peev xwm loj hlob nyob rau yav tom ntej ntawm FPC nto kho yog siv cov ntaub ntawv tshiab nrog cov khoom txhim kho.Cov kws tshawb fawb tab tom tshawb nrhiav kev siv cov txheej txheem tshiab thiab cov khoom siv los txhim kho kev ua tau zoo thiab kev ntseeg siab ntawm FPC hloov pauv PCBs.Piv txwv li, cov txheej txheem kho tus kheej tau raug tshawb fawb, uas tuaj yeem kho qhov kev puas tsuaj lossis khawb rau saum npoo ntawm PCB, yog li ua rau nws txoj sia thiab kav ntev.Tsis tas li ntawd, cov ntaub ntawv nrog kev txhim kho thermal conductivity tau raug tshawb nrhiav los txhim kho FPC lub peev xwm los ua kom cov cua sov kom ua tau zoo dua hauv cov ntawv thov kub.
Lwm qhov kev txhim kho yav tom ntej yog kev nce qib ntawm cov txheej txheem txheej txheej txheej txheem.Cov txheej txheem txheej txheej tshiab tau raug tsim los muab kev pabcuam meej dua thiab zoo ib yam ntawm FPC qhov chaw.Cov txheej txheem xws li Atomic Layer Deposition (ALD) thiab Plasma Enhanced Chemical Vapor Deposition (PECVD) tso cai rau kev tswj cov txheej tuab thiab muaj pes tsawg leeg zoo dua, ua rau kev txhim kho solderability thiab adhesion.Cov txheej txheem thev naus laus zis no tseem muaj peev xwm los txo cov txheej txheem sib txawv thiab txhim kho kev tsim khoom tag nrho.
Tsis tas li ntawd, muaj kev nthuav dav ntxiv rau kev daws teeb meem ib puag ncig tus phooj ywg.Nrog cov kev cai nce ntxiv thiab kev txhawj xeeb txog kev cuam tshuam ib puag ncig ntawm cov txheej txheem kev npaj saum npoo ib txwm muaj, cov kws tshawb fawb tab tom tshawb nrhiav kev nyab xeeb dua thiab muaj txiaj ntsig zoo dua.Piv txwv li, cov dej-raws li cov txheej txheem tau txais kev muaj koob meej vim lawv qhov qis qis dua cov organic compound (VOC) emissions piv rau cov kuab tshuaj los ntawm cov txheej txheem.Tsis tas li ntawd, kev siv zog tab tom tsim los txhim kho ib puag ncig tus phooj ywg etching txheej txheem uas tsis tsim tshuaj lom los ntawm cov khoom lossis pov tseg.
Los xaus,cov txheej txheem kho saum npoo ua lub luag haujlwm tseem ceeb hauv kev ua kom ntseeg tau thiab ua haujlwm ntawm FPC soft board.Los ntawm kev nkag siab txog qhov tseem ceeb ntawm kev npaj saum npoo thiab xaiv txoj kev tsim nyog, cov tuam ntxhab tuaj yeem tsim cov khoom siv hluav taws xob hloov tau zoo uas ua tau raws li qhov xav tau ntawm ntau yam kev lag luam.Ua raws li txheej txheem kev kho saum npoo av, ua cov kev ntsuam xyuas zoo, thiab daws cov teeb meem kho qhov chaw zoo yuav ua rau muaj kev vam meej thiab ntev ntawm FPC hloov pauv PCBs hauv khw.