Taw qhia: Kev Sib Tw Hauv Kev Siv Hluav Taws Xob Automotive thiabCapel's Innovations

Raws li kev tsav tsheb tsis muaj zog hloov mus rau L5 thiab lub tsheb hluav taws xob (EV) roj teeb tswj kev tswj hwm (BMS) xav tau lub zog ntau dua thiab kev nyab xeeb, cov txheej txheem PCB ib txwm tawm tsam los daws cov teeb meem tseem ceeb:

• Thermal Runaway Risks: ECU chipsets tshaj 80W lub zog noj, nrog rau qhov kub thiab txias mus txog 150 ° C
• 3D Integration Limits: BMS yuav tsum tau 256+ teeb liab raws li 0.6 hli board thickness
• Vibration Failures: Autonomous sensors yuav tsum tiv taus 20G mechanical shocks
• Miniaturization Xav tau: LiDAR controllers xav tau 0.03mm kab dav dav thiab 32-txheej stacking

Capel Technology, leveraging 15 xyoo ntawm R&D, qhia txog kev hloov pauv kev sib txuassiab thermal conductivity PCBs(2.0W / mK),high-temperature resistant PCBs(-55 ° C ~ 260 ° C), thiab32- txheejHDI faus / dig muag los ntawm kev siv tshuab(0.075mm microvias).

Tshooj 1: Thermal Management Revolution for Autonomous Driving ECUs

1.1 ECU Thermal Challenges

• Nvidia Orin chipset kub flux ceev: 120W / cm²
• Pa FR-4 substrates (0.3W / mK) ua rau 35% nti hlws ris kub overshoot
• 62% ntawm ECU tsis ua hauj lwm los ntawm thermal stress-induced solder qaug zog

1.2 Capel's Thermal Optimization Technology

Cov khoom siv tshiab:

• Nano-alumina reinforced polyimide substrates (2.0 ± 0.2W / mK thermal conductivity)
• 3D tooj liab ncej arrays (400% nce tshav kub dissipation cheeb tsam)

Cov txheej txheem tawg:

• Laser Direct Structuring (LDS) rau kev ua kom zoo thermal
• Hybrid stacking: 0.15mm ultra-nyias tooj liab + 2oz hnyav tooj liab txheej

Kev sib piv:

Kauj Ruam 2: BMS Wiring Revolution nrog 32-Layer HDI Technology

2.1 Kev Lag Luam Pain Points hauv BMS Tsim

• 800V platforms xav tau 256+ cell voltage xyuas raws
• Cov qauv tsim qauv tshaj qhov chaw txwv los ntawm 200% nrog 15% impedance mismatch

2.2 Capel's High-Density Interconnect Solutions

Stackup Engineering:

• 1 + N + 1 txhua txheej HDI qauv (32 txheej ntawm 0.035mm thickness)
• ± 5% sib txawv impedance tswj (10Gbps high-speed signals)

Microvia Technology:

• 0.075mm laser-dig muag vias (12: 1 nam piv)
• <5% plating void tus nqi (IPC-6012B Class 3 raws)

Cov txiaj ntsig ntawm Benchmark:

Nqe Lus 3: Kev Ntseeg Ib puag ncig Tsis Txaus - MIL-SPEC Certified Solutions

3.1 Cov khoom siv kub kub ua haujlwm

• Kev hloov pauv iav (Tg): 280 ° C (IPC-TM-650 2.4.24C)
• Decomposition Temp (Td): 385 ° C (5% poob phaus)
• Thermal Shock Ciaj sia taus: 1,000 cycles (-55°C↔260°C)

3.2 Proprietary Protection Technologies

• Plasma-grafted polymer txheej (1,000h ntsev tsuag tsis kam)
• 3D EMI shielding kab noj hniav (60dB attenuation @ 10GHz)

Ntu 4: Case Study – Kev Koom Tes Nrog Ntiaj Teb Sab saum toj 3 EV OEM

4.1 800V BMS Tswj Module

• Kev sib tw: Kev sib xyaw 512-channel AFE hauv 85 × 60mm qhov chaw
• Kev daws:
  1. 20-txheej rigid-flex PCB (3mm khoov vojvoog)
  2. Embedded kub sensor network (0.03mm kab dav)
  3. Localized hlau-core txias (0.15 ° C·cm² / W thermal kuj)

4.2 L4 Autonomous Domain Controller

• Cov txiaj ntsig:
  • 40% txo hwj chim (72W → 43W)
  • 66% txo qhov loj me vs. cov qauv tsim
  • ASIL-D daim ntawv pov thawj kev nyab xeeb

Tshooj 5: Daim Ntawv Pov Thawj thiab Kev Pov Hwm Zoo

Capel txoj kev ua tau zoo tshaj li cov qauv tsheb:

• MIL-SPEC Certification: Ua raws li GJB 9001C-2017
• Automotive Ua raws cai: IATF 16949: 2016 + AEC-Q200 validation
• Kev Ntsuam Xyuas Kev Ntseeg:
  • 1,000h HAST (130 ° C / 85% RH)
  • 50G mechanical shock (MIL-STD-883H)

Xaus: Next-Gen PCB Technology Roadmap

Capel yog pioneering:

• Embedded passive Cheebtsam (30% chaw txuag)
• Optoelectronic hybrid PCBs (0.2dB/cm poob @ 850nm)
• AI-tsav DFM systems (15% yield txhim kho)

Hu rau peb pab pawg engineeringniaj hnub no los sib koom ua ke tsim kho PCB kev daws teeb meem rau koj cov khoom siv hluav taws xob txuas ntxiv mus.