Mastering High-Speed ​​​​Digital Signals HDI PCB Prototyping

Qhia:

Zoo siab txais tos rau Capel's blog, qhov twg peb lub hom phiaj yog los muab cov lus qhia dav dav rau prototyping HDI PCBs siv high-speed digital signals. Nrog rau 15 xyoo ntawm kev tsim hluav taws xob Circuit Court board, peb cov neeg ua haujlwm siab tshaj plaws tuaj yeem pab koj nrhiav qhov nyuaj ntawm kev tsim qauv thiab tsim khoom. Peb muab kev pabcuam ua ntej muag thiab tomqab muag muag kom ntseeg tau tias cov neeg siv khoom txaus siab.Hauv tsab xov xwm no, peb mam li piav qhia txog qhov nyuaj ntawm HDI PCB prototyping, qhia txog qhov tseem ceeb ntawm cov teeb liab ceev ceev, thiab muab cov lus pom muaj txiaj ntsig los pab koj ua tau zoo hauv kev ua haujlwm.

Ntu 1: Nkag siab qhov cuam tshuam ntawm HDI PCB Prototyping

Txhawm rau kom ua tiav qhov kev ua tau zoo thiab kev ua haujlwm, nws yog ib qho tseem ceeb kom nkag siab qhov tseem ceeb ntawm HDI PCB prototyping hauv cov ntawv thov digital high-ceev. High-density interconnect (HDI) PCBs yog tsim los ua kom haum rau ntau txheej txheej thiab kev sib txuas ua ke, yog li txhim kho cov teeb meem kev ncaj ncees, txo kev cuam tshuam, thiab txhim kho hluav taws xob ua haujlwm. Cov khoom no tau dhau los ua qhov tseem ceeb thaum ua cov teeb liab ceev ceev, qhov twg txawm tias me me impedance mismatches lossis teeb liab distortion tuaj yeem ua rau cov ntaub ntawv tsis ncaj ncees lossis poob.

Nqe Lus 2: Cov Ntsiab Lus Tseem Ceeb rau Prototyping HDI PCBs

2.1 Tsim rau Manufacturability (DfM)
Tsim rau Manufacturability (DfM) plays lub luag haujlwm tseem ceeb hauv HDI PCB prototyping. Ua haujlwm ze nrog pawg thawj coj tsim qauv thaum lub sijhawm pib lub tswv yim tso cai rau kev sib koom ua ke ntawm cov qauv tsim thiab kev tsim muaj peev xwm. Los ntawm kev koom nrog DfM cov hauv paus ntsiab lus xws li kev ua kom pom qhov dav dav, xaiv cov khoom tsim nyog, thiab txiav txim siab qhov kev tso kawm, koj tuaj yeem txo cov teeb meem kev tsim khoom thiab txo cov nqi tag nrho.

2.2 Kev xaiv cov khoom siv
Xaiv cov ntaub ntawv tsim nyog rau HDI PCB prototypes yog qhov tseem ceeb rau kev ua tiav cov khoom siv hluav taws xob zoo thiab kev ntseeg tau. Cov ntaub ntawv uas tsis tshua muaj dielectric tsis tu ncua, tswj cov khoom impedance, thiab cov yam ntxwv zoo tshaj plaws yuav tsum tau nrhiav. Tsis tas li ntawd, xav txog kev siv tshwj xeeb high-speed laminates kom nruj tswj cov teeb liab kev ncaj ncees thiab txo cov teeb liab poob.

2.3 Stackup tsim thiab teeb liab kev ncaj ncees
Kev tsim cov stackup tsim nyog tuaj yeem cuam tshuam cov teeb liab kev ncaj ncees thiab kev ua haujlwm tag nrho. Txheej txheej, tooj liab thickness, thiab dielectric thickness yuav tsum tau ua tib zoo npaj kom txo tau crosstalk, teeb liab poob, thiab electromagnetic cuam tshuam. Siv cov cuab yeej tswj impedance routing thev naus laus zis thaum ua raws li cov qauv kev lag luam pab tswj cov teeb liab kev ncaj ncees thiab txo qhov kev xav.

Tshooj 3: HDI PCB Prototyping Technology

3.1 Microhole Laser Drilling
Microvias yog qhov tseem ceeb rau kev ua tiav high-density circuitry hauv HDI PCBs thiab tuaj yeem tsim tau zoo siv laser drilling tshuab. Laser drilling enables meej tswj ntawm qhov loj me, nam piv thiab ncoo loj, ua kom ntseeg tau kev sib txuas txawm nyob rau hauv daim ntawv me me. Ua hauj lwm nrog ib tug paub txog PCB chaw tsim tshuaj paus zoo li Capel kom meej meej ua tiav cov txheej txheem complex ntawm laser drilling.
3.2 Sequential lamination
Sequential lamination yog ib qho cuab yeej tseem ceeb siv hauv HDI PCB prototyping txheej txheem thiab koom nrog lamination ntau txheej ua ke. Qhov no tso cai rau kev nruj dua, txo qis kev sib txuas ntev, thiab txo cov kab mob cab. Los ntawm kev siv thev naus laus zis lamination xws li Build-Up Process (BUP), koj tuaj yeem ua tiav qhov ntom ntom dua yam tsis muaj kev cuam tshuam cov teeb liab kev ncaj ncees.

Nqe Lus 4: Cov Kev Cai Zoo Tshaj Plaws rau Kev Ua Haujlwm Siab-Speed ​​​​Digital Signal Integrity

4.1 Impedance tswj thiab teeb liab kev ntsuam xyuas kev ncaj ncees
Kev siv cov txheej txheem tswj impedance xws li kev tswj cov kab mob impedance thiab impedance txuam yog qhov tseem ceeb rau kev tswj cov teeb liab kev ncaj ncees nyob rau hauv high-speed digital designs. Cov cuab yeej simulation qib siab tuaj yeem pab koj txheeb xyuas cov teeb meem kev ncaj ncees, txheeb xyuas qhov muaj peev xwm hloov pauv, thiab txhim kho PCB layout kom haum.

4.2 Cov Txheej Txheem Tsim Kev Ncaj Ncees Ncaj Ncees
Ua raws li kev lag luam-tus qauv tsim cov txheej txheem rau high-speed digital signals tuaj yeem txhim kho tag nrho cov kev ua tau zoo ntawm koj HDI PCB qauv. Qee qhov kev coj ua kom nco qab yog txo qis kev tsis sib xws, txhim kho txoj hauv kev rov qab los, thiab txo tus naj npawb ntawm vias nyob rau hauv qhov chaw siab. Ua haujlwm nrog peb pab neeg tshawb fawb thiab kev txhim kho kev paub dhau los tuaj yeem pab koj ua raws li cov lus qhia no zoo.

Hauv kev xaus:

Prototyping HDI PCBs siv high-speed digital signals yuav tsum tau ua tib zoo saib xyuas kom meej.Los ntawm kev siv Capel txoj kev txawj ntse thiab kev paub dhau los, koj tuaj yeem txhim kho cov txheej txheem, txo cov kev pheej hmoo ntau lawm thiab ua tiav cov txiaj ntsig zoo dua. Txawm hais tias koj xav tau prototyping sai lossis ntim ntau lawm, peb cov chaw tsim khoom hauv Circuit Court tuaj yeem ua tau raws li koj qhov yuav tsum tau ua. Hu rau peb cov kws tshaj lij niaj hnub no kom tau txais kev sib tw hauv lub ntiaj teb ceev ceev ntawm cov teeb liab siab ceev HDI PCB kev tsim khoom.