PCB prototyping rau kev siv ntau zaus

Kev siv ntau zaus yuav tsum tau ua tib zoo saib xyuas kom meej thiab meej cov txheej txheem tsim khoom. Thaum nws los txog rau PCB prototyping rau cov ntawv thov, cov kev cai tshwj xeeb yuav tsum tau ua kom ntseeg tau tias kev ua tau zoo thiab kev ntseeg tau. Capel muaj 15 xyoo ntawm kev paub nyob rau hauv Circuit Court board tej yaam num thiab tau tsim muaj kev txawj ntse nyob rau hauv PCB prototyping rau high zaus daim ntawv thov. Peb cov kws tshaj lij R & D pab pawg tau cog lus los muab cov qauv tsim PCB sai thiab txhim khu kev qha rau cov neeg siv khoom hauv kev lag luam high-frequency. Los ntawm kev yuav khoom mus rau kev tsim khoom thiab kev sim, peb muab ib qho kev daws teeb meem txhim khu kev qha.

Ua ntej peb delve rau hauv cov kev cai tshwj xeeb rau PCB prototyping nyob rau hauv high-frequency daim ntaub ntawv, cia peb xub to taub dab tsi yog thiab npaum prototyping txhais tau tias nyob rau hauv daim teb no.Kev siv ntau zaus suav nrog kev lag luam xws li kev sib txuas lus, aerospace, khoom siv kho mob, thiab wireless systems. Hauv cov kev lag luam no, cov teeb liab zaus ntau dua thiab kev txais tos yog qhov tseem ceeb.

PCB prototyping rau high-frequency daim ntawv thov yuav tsum tau ua tib zoo xav txog ntau yam tseem ceeb los xyuas kom meej lub teeb pom kev zoo, kev poob tsawg, thiab txo kev cuam tshuam. Cia peb tshawb txog qee qhov yuav tsum tau ua kom ntxaws:

1. Kev xaiv cov khoom siv: Xaiv cov khoom siv PCB zoo yog qhov tseem ceeb rau kev siv ntau zaus.Dielectric qhov tsis tu ncua (Dk), dissipation factor (Df) thiab thermal conductivity yog qhov tseem ceeb los xav txog. Cov ntaub ntawv xws li PTFE lossis PTFE laminates muaj cov khoom siv hluav taws xob zoo heev thiab tsis tshua muaj teeb liab poob ntawm qhov siab.

2. Stackup tsim: Tsim nyog stackup yog qhov tseem ceeb rau kev ua tiav cov kev tswj xyuas impedance.Kev tuav lub dielectric thickness zoo ib yam thiab tooj liab plating thickness yog qhov tseem ceeb rau lub teeb liab kev ncaj ncees. Tswj impedance pab txo cov teeb liab cuam tshuam thiab poob, kom ntseeg tau cov ntaub ntawv xa mus.

3. Tswj impedance: impedance txuam yog ib qho tseem ceeb rau high-speed digital signals thiab RF circuits.Cov teeb liab nrog cov impedance sib txawv tuaj yeem ua rau cov teeb liab cuam tshuam, teeb liab attenuation, thiab kev ua haujlwm tag nrho. Rau kev siv ntau zaus, kev tswj hwm impedance ntawm tag nrho PCB yog qhov tsim nyog.

4. Cov txheej txheem hauv av thiab lub zog: Cov txheej txheem hauv av ua tau zoo ua lub luag haujlwm tseem ceeb hauv kev tsim qauv siab.Ib lub dav hlau nyob hauv av zoo ib yam muab txoj hauv kev qis-impedance rov qab rau tam sim no ntws, txo cov teeb liab cuam tshuam thiab crosstalk. Kev faib hluav taws xob zoo dav hlau pab muab lub zog huv, ruaj khov thoob plaws hauv lub rooj tsavxwm.

5. RF Shielding: Txhawm rau tiv thaiv electromagnetic cuam tshuam (EMI) thiab xov tooj cua zaus cuam tshuam (RFI), nws yog ib qho tseem ceeb uas yuav tsum tau siv RF shielding technology tsim nyog.Copper shielding, RF shielding cov kaus poom, thiab cov tswv yim kev tso kawm ntawm cov khoom tuaj yeem txo qhov cuam tshuam ntawm sab nraud cuam tshuam thiab txhim kho cov teeb liab zoo.

6. Cheebtsam tso thiab routing: Cheebtsam tso thiab routing yuav tsum tau ua tib zoo txiav txim siab kom txo tau txhuas ntev thiab teeb liab cuam tshuam.Cov kab luv luv txo cov teeb liab tawm lub sij hawm, yog li txo qhov kev pheej hmoo ntawm teeb liab degradation. Kev sib cais hauv av kom zoo thiab kev sib cais suab nrov kuj tseem ceeb heev.

7. Teeb liab kab hla hla: Hauv kev siv ntau zaus, cov teeb liab kab hla hla yuav tsum tau zam los yog ua tib zoo npaj kom txo qis qhov cuam tshuam tsis zoo ntawm lub teeb liab.Kev sib nrug kom zoo thiab kev sib cais pab txo cov teeb liab distortion thiab crosstalk.

8. Kev Ntsuas thiab Kev Ntsuas: Cov txheej txheem kuaj nruj thiab siv tau yog qhov tseem ceeb kom ntseeg tau tias muaj kev ntseeg siab thiab ua haujlwm ntawm cov qauv PCB ntau zaus.Cov txheej txheem xeem qib siab, xws li lub sijhawm ntsuas qhov ntsuas lub sijhawm (TDR), tuaj yeem pab ntsuas kev ua tau zoo thiab kuaj xyuas cov teeb meem kev ncaj ncees.

Ntawm Capel, peb nkag siab qhov tseem ceeb ntawm cov kev cai tshwj xeeb no rau PCB prototyping hauv cov ntawv thov ntau zaus. Nrog peb 15 xyoo ntawm kev paub thiab kev txawj R & D pab neeg, peb tau mastered lub kos duab ntawm tsim txhim khu kev qha thiab npaum PCB prototypes. Peb ib-nres txhim khu kev qha kev daws teeb meem suav nrog kev yuav khoom, tsim khoom thiab kev sim, lav cov neeg siv khoom txaus siab.

Hauv cov ntsiab lus, PCB prototyping rau high-frequency daim ntaub ntawv yuav tsum tau saib xyuas kom meej thiab ua raws li cov kev cai tshwj xeeb.Cov ntaub ntawv, stackup tsim, impedance tswj, grounding cov tswv yim, RF shielding, tivthaiv layout thiab xeem cov txheej txheem tag nrho ua lub luag haujlwm tseem ceeb hauv kev ua kom pom kev ua haujlwm zoo.Capel qhov kev txawj ntse hauv PCB qauv tsim rau cov ntawv thov ntau zaus ua rau peb yog tus khub zoo tshaj plaws rau cov tuam txhab hauv kev lag luam kev siv ntau zaus. Cia siab rau peb kom xa sai, txhim khu kev qha PCB prototypes uas ua tau raws li koj cov kev xav tau tshwj xeeb thiab tshaj qhov koj xav tau.