daws ob sab pcb thermal expansion thiab thermal stress teeb meem

Puas yog koj tab tom ntsib thermal expansion thiab thermal stress teeb meem nrog ob-sided PCBs? Tsis txhob saib ntxiv, hauv tsab ntawv blog no peb yuav qhia koj txog yuav daws cov teeb meem no li cas. Tab sis ua ntej peb dhia mus rau hauv cov kev daws teeb meem, cia peb qhia peb tus kheej.

Capel yog cov chaw tsim khoom muaj kev paub dhau los hauv kev lag luam Circuit Court board thiab tau ua haujlwm rau cov neeg siv khoom rau 15 xyoo. Nws muaj nws tus kheej saj zawg zog board Hoobkas, rigid-flex Circuit Court board Hoobkas, smt Circuit Court board los ua ke Hoobkas, thiab tau tsim ib lub koob npe nrov nyob rau hauv zus tau tej cov high-zoo mid-rau-high-end circuit boards. Peb cov khoom siv hluav taws xob ua haujlwm siab tshaj plaws thiab cov khoom siv R & D muaj kev cuam tshuam txog peb txoj kev mob siab rau kev ua tau zoo. Tam sim no, cia peb rov qab los daws qhov teeb meem ntawm thermal expansion thiab thermal stress ntawm ob sab PCBs.

Thermal expansion thiab thermal stress yog ib qho kev txhawj xeeb hauv PCB kev lag luam. Cov teeb meem no tshwm sim vim qhov sib txawv ntawm cov coefficient ntawm thermal expansion (CTE) ntawm cov khoom siv hauv PCB. Thaum cua sov, cov ntaub ntawv nthuav dav, thiab yog tias qhov nthuav dav ntawm cov khoom sib txawv sib txawv, kev ntxhov siab tuaj yeem tsim thiab ua rau PCB tsis ua haujlwm. Txhawm rau daws cov teeb meem no, thov ua raws li cov lus qhia no:

1. Cov khoom siv xaiv:

Xaiv cov khoom siv nrog CTE qhov tseem ceeb. Los ntawm kev siv cov ntaub ntawv nrog cov kev nthuav dav zoo sib xws, lub peev xwm rau kev ntxhov siab thermal thiab cov teeb meem ntsig txog kev nthuav dav tuaj yeem txo qis. Tham nrog peb cov kws tshaj lij lossis sab laj cov qauv kev lag luam los txiav txim siab cov ntaub ntawv zoo tshaj plaws rau koj cov kev xav tau tshwj xeeb.

2. Kev txiav txim siab tsim:

Xav txog PCB layout thiab tsim kom txo tau thermal stress. Nws raug nquahu kom khaws cov khoom kub-dissipating kom deb ntawm thaj chaw uas muaj qhov kub thiab txias hloov pauv. Kev ua kom txias kom zoo, siv cov thermal vias, thiab sib xyaw cov qauv thermal kuj tuaj yeem pab kom cov cua sov kom zoo thiab txo cov kev ntxhov siab.

3. Txheej stacking:

Cov txheej txheej txheej ntawm ob sab PCB cuam tshuam rau nws tus cwj pwm thermal. Kev sib npaug thiab sib luag layup pab faib cov cua sov kom sib npaug, txo txoj hauv kev ntawm thermal stress. Tham nrog peb cov engineers los tsim cov txheej txheem los daws koj cov teeb meem thermal expansion.

4. Copper thickness thiab thaiv:

Copper thickness thiab kab dav dav ua lub luag haujlwm tseem ceeb hauv kev tswj cov kev ntxhov siab thermal. Thicker tooj liab txheej muab thermal conductivity zoo dua thiab tuaj yeem txo qhov cuam tshuam ntawm thermal expansion. Ib yam li ntawd, cov kab dav dav txo qis kev tiv thaiv thiab pab kom muaj cua sov kom zoo.

5. Kev xaiv ntawm prepreg thiab cov khoom tseem ceeb:

Xaiv prepreg thiab cov ntaub ntawv tseem ceeb nrog CTE zoo ib yam li tooj liab cladding kom txo qhov kev pheej hmoo ntawm delamination vim thermal stress. Kev kho kom zoo thiab kev sib koom ua ke prepreg thiab cov ntaub ntawv tseem ceeb yog qhov tseem ceeb rau kev tswj xyuas qhov kev ncaj ncees ntawm PCB.

6. Tswj impedance:

Kev tswj hwm impedance thoob plaws hauv PCB tsim pab tswj kev ntxhov siab thermal. Los ntawm kev khaws cov teeb liab txoj kev luv luv thiab zam kev hloov pauv sai sai hauv kab dav, koj tuaj yeem txo qhov kev hloov pauv impedance los ntawm thermal expansion.

7. Thermal tswj tshuab:

Siv cov txheej txheem tswj xyuas thermal xws li cov dab dej kub, cov ntaub qhwv thermal, thiab cov thermal vias tuaj yeem pab kom cov cua sov tau zoo. Cov thev naus laus zis no txhim kho tag nrho cov thermal kev ua tau zoo ntawm PCB thiab txo qhov kev pheej hmoo ntawm thermal stress-related failures.

Los ntawm kev siv cov tswv yim no, koj tuaj yeem txo qhov thermal expansion thiab thermal stress teeb meem hauv ob sab PCBs. Ntawm Capel, peb muaj cov kws tshaj lij thiab cov peev txheej los pab koj kov yeej cov teeb meem no. Peb pab neeg ntawm cov kws tshaj lij tuaj yeem muab cov kev taw qhia tseem ceeb thiab kev txhawb nqa ntawm txhua theem ntawm koj cov txheej txheem tsim khoom PCB.

Tsis txhob cia thermal expansion thiab thermal stress cuam tshuam rau kev ua tau zoo ntawm koj ob sab PCB. Hu rau Capel hnub no thiab paub txog qhov zoo thiab kev ntseeg siab uas tuaj nrog peb 15 xyoo ntawm kev paub hauv kev lag luam Circuit Court board. Cia peb ua hauj lwm ua ke los tsim ib lub PCB uas ua tau raws li qhov koj xav tau.