Kev tsim cov txheej txheem ntawm HDI Technology PCBs: Ua kom muaj kev ua tau zoo thiab kev ntseeg tau

Nyob rau niaj hnub no txoj kev loj hlob sai sai, cov khoom siv hluav taws xob tau dhau los ua ib feem tseem ceeb ntawm peb lub neej niaj hnub. Los ntawm cov xov tooj smartphones mus rau cov khoom siv kho mob, cov ntawv luam tawm hluav taws xob (PCBs) ua lub luag haujlwm tseem ceeb hauv kev ua kom muaj zog ntawm cov khoom siv no. High Density Interconnect (HDI) thev naus laus zis PCBs tau ua qhov hloov pauv kev ua si, muab cov khoom siv hluav taws xob ntau dua, txhim kho kev ua haujlwm thiab txhim kho kev ntseeg tau.Tab sis koj puas tau xav paub yuav ua li cas cov HDI thev naus laus zis PCBs tsim? Nyob rau hauv tsab xov xwm no, peb yuav dhia mus rau hauv qhov intricacies ntawm kev tsim khoom thiab qhia meej cov kauj ruam uas cuam tshuam.

1. Kev taw qhia luv luv ntawm HDI thev naus laus zis PCB:

HDI thev naus laus zis PCBs yog qhov nrov rau lawv lub peev xwm los ua kom haum rau ntau cov khoom siv hauv cov qauv tsim, txo qhov loj ntawm cov khoom siv hluav taws xob tag nrho.Cov boards no muaj ntau txheej txheej, cov vias me me, thiab cov kab nyias nyias rau kev sib tw ntau dua. Tsis tas li ntawd, lawv muaj kev txhim kho hluav taws xob, kev tswj xyuas impedance, thiab teeb liab kev ncaj ncees, ua rau lawv zoo tagnrho rau kev siv high-speed thiab high-frequency.

2. Tsim layout:

Kev tsim khoom ntawm HDI Technology PCB pib los ntawm theem tsim.Cov kws tshaj lij engineers thiab cov neeg tsim qauv ua haujlwm ua ke txhawm rau txhim kho kev teeb tsa hauv Circuit Court thaum ua kom ntseeg tau tias tsim cov cai thiab cov kev txwv tau ua tiav. Siv cov cuab yeej software siab heev los tsim cov qauv tsim tshwj xeeb, txhais cov txheej txheem stackups, kev tso kawm thiab routing. Lub layout kuj yuav siv sij hawm mus rau hauv tus account yam xws li teeb liab kev ncaj ncees, thermal tswj, thiab mechanical stability.

3. Laser drilling:

Ib qho ntawm cov kauj ruam tseem ceeb hauv HDI thev naus laus zis PCB tsim yog laser drilling.Laser thev naus laus zis tuaj yeem tsim qhov me me, meej dua vias, uas yog qhov tseem ceeb rau kev ua tiav qhov siab ntawm Circuit Court. Laser drilling tshuab siv lub teeb hluav taws xob siab ntawm lub teeb kom tshem tawm cov khoom ntawm lub substrate thiab tsim cov qhov me me. Cov vias no ces metallized los tsim hluav taws xob sib txuas ntawm cov txheej txheem sib txawv.

4. Electroless tooj liab plating:

Txhawm rau kom muaj txiaj ntsig hluav taws xob sib cuam tshuam ntawm cov txheej txheem, electroless tooj liab deposition yog ua haujlwm.Nyob rau hauv cov txheej txheem no, cov phab ntsa ntawm lub qhov drilled yog coated nrog ib tug nyias txheej ntawm conductive tooj liab los ntawm tshuaj immersion. Cov txheej tooj liab no ua cov noob rau cov txheej txheem electroplating tom ntej, txhim kho tag nrho cov adhesion thiab conductivity ntawm tooj liab.

5. Lamination thiab nias:

HDI Technology PCB kev tsim khoom suav nrog ntau lub lamination thiab nias lub voj voog uas cov txheej txheem sib txawv ntawm pawg thawj coj saib tau sib dhos thiab sib koom ua ke.Kev kub siab thiab kub yog siv los ua kom muaj kev sib raug zoo thiab tshem tawm cov hnab ris lossis cov voids. Cov txheej txheem suav nrog kev siv cov cuab yeej tshwj xeeb lamination kom ua tiav qhov xav tau board thickness thiab mechanical stability.

6. Tooj plating:

Copper plating plays lub luag haujlwm tseem ceeb hauv HDI thev naus laus zis PCBs vim nws tsim cov hluav taws xob tsim nyog.Cov txheej txheem suav nrog dipping tag nrho lub rooj tsavxwm rau hauv cov tshuaj tooj liab plating thiab hla cov hluav taws xob los ntawm nws. Los ntawm cov txheej txheem electroplating, tooj liab tau muab tso rau saum npoo ntawm lub rooj tsav xwm hauv Circuit Court, tsim cov kab hluav taws xob, cov kab thiab cov nta saum npoo.

7. Kev kho deg:

Kev kho deg yog ib kauj ruam tseem ceeb hauv cov txheej txheem tsim khoom los tiv thaiv circuits thiab ua kom muaj kev ntseeg tau ntev.Cov thev naus laus zis kho mob saum npoo rau HDI thev naus laus zis PCBs suav nrog cov nyiaj immersion, immersion kub, organic solderability preservatives (OSP), thiab electroless nickel / immersion kub (ENIG). Cov thev naus laus zis no muab cov txheej txheem tiv thaiv uas tiv thaiv oxidation, txhim kho solderability, thiab yooj yim sib dhos.

8. Kev Ntsuas thiab Kev Tswj Xyuas Zoo:

Kev ntsuas nruj thiab kev tswj xyuas zoo yuav tsum tau ua ua ntej HDI thev naus laus zis PCBs tau sib sau ua ke rau hauv cov khoom siv hluav taws xob.Automated optical inspection (AOI) thiab kev ntsuam xyuas hluav taws xob (E-test) feem ntau ua los xyuas thiab kho cov teeb meem lossis teeb meem hluav taws xob hauv Circuit Court. Cov kev ntsuam xyuas no xyuas kom meej tias cov khoom kawg ua tau raws li qhov xav tau tshwj xeeb thiab ua tau zoo.

Hauv kev xaus:

HDI Technology PCBs tau hloov pauv kev lag luam hluav taws xob, ua kom yooj yim rau kev tsim cov khoom siv hluav taws xob me me, sib dua, thiab muaj zog dua.Nkag siab txog cov txheej txheem tsim khoom nyuaj tom qab cov laug cam qhia txog qib ntawm qhov tseeb thiab kev txawj ntse uas yuav tsum tau ua los tsim cov tshuab HDI zoo PCBs. Los ntawm kev tsim thawj zaug los ntawm kev drilling, plating thiab qhov chaw npaj, txhua kauj ruam yog qhov tseem ceeb los xyuas kom meej qhov ua tau zoo thiab kev ntseeg tau. Los ntawm kev siv cov txheej txheem kev tsim khoom siab heev thiab ua raws li cov qauv kev tswj hwm nruj, cov tuam ntxhab tuaj yeem ua tau raws li qhov xav tau hloov pauv ntawm kev lag luam hluav taws xob thiab ua rau txoj hauv kev rau kev hloov pauv tshiab.