High-density interconnect (HDI) printed circuit boards (PCBs) tau hloov pauv kev lag luam hluav taws xob los ntawm kev tsim cov khoom siv hluav taws xob me me, sib dua, thiab siv tau zoo dua.Nrog rau qhov txuas txuas ntxiv ntawm cov khoom siv hluav taws xob txuas ntxiv, cov tsoos los ntawm qhov tsis txaus los ua kom tau raws li cov kev xav tau ntawm cov qauv tsim niaj hnub no. Qhov no tau coj mus rau kev siv microvias, qhov muag tsis pom thiab faus vias hauv HDI PCB Board. Hauv blog no, Capel yuav ua tib zoo saib cov hom vias no thiab sib tham txog lawv qhov tseem ceeb hauv HDI PCB tsim.
1. Micropore:
Microholes yog qhov me me nrog txoj kab uas hla ntawm 0.006 txog 0.15 ntiv tes (0.15 txog 0.4 hli). Lawv feem ntau siv los tsim kev sib txuas ntawm cov khaubncaws sab nraud povtseg ntawm HDI PCBs. Tsis zoo li vias, uas dhau los ntawm tag nrho lub rooj tsavxwm, microvias tsuas yog ib nrab dhau los ntawm txheej txheej. Qhov no tso cai rau kom muaj kev sib txuas ntau dua thiab siv tau zoo dua ntawm qhov chaw board, ua rau lawv tseem ceeb hauv kev tsim cov khoom siv hluav taws xob compact.
Vim lawv qhov me me, micropores muaj ntau yam zoo. Ua ntej, lawv ua kom cov routing ntawm nplua-pitch Cheebtsam xws li microprocessors thiab nco chips, txo cov kab ntev thiab txhim kho teeb liab kev ncaj ncees. Tsis tas li ntawd, microvias pab txo cov teeb liab suab nrov thiab txhim kho kev kub ceev teeb liab kis tus yam ntxwv los ntawm kev muab cov teeb liab luv luv. Lawv kuj ua rau muaj kev tswj xyuas thermal zoo dua, vim tias lawv tso cai rau cov thermal vias kom muab tso rau ze rau cov khoom siv hluav taws xob.
2. Qhov muag qhov muag:
Qhov muag tsis pom kev zoo ib yam li microvias, tab sis lawv txuas ntxiv los ntawm txheej txheej ntawm PCB mus rau ib lossis ntau txheej sab hauv ntawm PCB, hla qee cov txheej nruab nrab. Cov vias no hu ua "dig muag vias" vim tias lawv tsuas pom los ntawm ib sab ntawm lub rooj tsavxwm. Qhov muag tsis pom vias feem ntau yog siv los txuas rau txheej txheej ntawm PCB nrog cov txheej sab hauv uas nyob ib sab. Piv nrog los ntawm qhov, nws tuaj yeem txhim kho txoj hlua khi thiab txo cov txheej txheem.
Kev siv cov dig muag vias yog qhov tseem ceeb tshwj xeeb tshaj yog nyob rau hauv high-density designs uas qhov chaw txwv yog qhov tseem ceeb. Los ntawm kev tshem tawm qhov xav tau los ntawm lub qhov drilling, qhov muag tsis pom ntawm cov teeb liab sib cais thiab lub dav hlau fais fab, txhim kho cov teeb liab kev ncaj ncees thiab txo cov teeb meem ntawm electromagnetic cuam tshuam (EMI). Lawv kuj ua lub luag haujlwm tseem ceeb hauv kev txo qis tag nrho cov tuab ntawm HDI PCBs, yog li ua rau cov ntaub ntawv me me ntawm cov khoom siv hluav taws xob niaj hnub no.
3. Lub qhov faus:
faus vias, raws li lub npe qhia, yog vias uas tau muab zais tag nrho hauv cov khaubncaws sab nraud povtseg ntawm PCB. Cov vias no tsis txuas mus rau ib qho txheej txheej sab nrauv thiab yog li "faus". Lawv feem ntau siv nyob rau hauv complex HDI PCB tsim uas muaj ntau txheej. Tsis zoo li microvias thiab dig muag vias, faus vias tsis pom los ntawm ob sab ntawm lub rooj tsavxwm.
Lub ntsiab kom zoo dua ntawm faus vias yog lub peev xwm los muab kev sib tshuam tsis siv cov txheej txheej sab nrauv, ua kom muaj kev sib txuas ntau dua. Los ntawm kev tso tawm qhov chaw muaj txiaj ntsig ntawm cov txheej txheej sab nrauv, faus vias tuaj yeem ua kom haum rau cov khoom siv ntxiv thiab cov cim, txhim kho kev ua haujlwm ntawm PCB. Lawv kuj pab txhim kho kev tswj xyuas thermal, vim tias cov cua sov tuaj yeem cuam tshuam zoo dua los ntawm cov txheej txheem sab hauv, tsis yog cia siab rau thermal vias ntawm cov txheej txheej sab nraud.
Hauv kev xaus,micro vias, dig muag vias thiab faus vias yog cov ntsiab lus tseem ceeb hauv HDI PCB board tsim thiab muab ntau yam zoo rau cov khoom siv me me thiab cov khoom siv hluav taws xob siab.Microvias ua kom cov kev coj ua tsis taus ntom thiab siv cov chaw muag khoom, thaum lub qhov muag tsis pom kev yooj yim thiab txo cov txheej suav. faus vias ntxiv nce routing ceev, tso cov txheej txheej sab nraud kom nce kev tso kawm thiab txhim kho thermal tswj.
Raws li kev lag luam hluav taws xob txuas ntxiv thawb cov ciam teb ntawm miniaturization, qhov tseem ceeb ntawm cov vias hauv HDI PCB Board tsim yuav tsuas loj hlob. Cov kws tsim khoom thiab cov tsim qauv yuav tsum nkag siab txog lawv lub peev xwm thiab kev txwv kom siv tau zoo thiab tsim cov khoom siv hluav taws xob uas ua tau raws li qhov xav tau ntawm cov cuab yeej niaj hnub no.Shenzhen Capel Technology Co., Ltd yog ib tug txhim khu kev qha thiab mob siab rau chaw tsim tshuaj paus ntawm HDI luam Circuit Court boards. Nrog rau 15 xyoo ntawm qhov kev paub dhau los thiab kev siv thev naus laus zis txuas ntxiv, lawv muaj peev xwm muab cov kev daws teeb meem zoo uas ua tau raws li cov neeg siv khoom xav tau. Lawv siv cov txuj ci kev txawj ntse, cov txheej txheem siab heev, thiab cov cuab yeej siv ntau lawm thiab cov tshuab kuaj xyuas kom ntseeg tau cov khoom lag luam zoo thiab cov nqi zoo. Txawm hais tias nws yog prototyping lossis loj ntau lawm, lawv cov kev paub dhau los ntawm cov kws tshaj lij hauv Circuit Board tau cog lus tias yuav xa thawj chav kawm HDI thev naus laus zis PCB kev daws teeb meem rau txhua qhov haujlwm.
Post lub sij hawm: Aug-23-2023
Rov qab